BMK Glycidic Acid (sodium salt) CAS 5449-12-7 | |
| Product name | BMK Glycidic Acid |
| Synonyms | BMK Glycidic Acid(sodiumsalt);sodium,2-methyl-3-phenyloxirane-2-carboxylicacid;2-methyl-3-phenyloxirane-2-carboxylicacid;sodium2-methyl-3-phenyloxirane-2-cChemicalbookarboxylate;BMKGlycidicAcid(sodiumsalt)l)-9-methoxy-3-oxo-3H-benzo[f]chromene-2-carboxylate;GlycidicAcidsodiumsalt;BMKGlycidicAcidpowder;BMKPowderandBMKOil |
| CAS No. | 5449-12-7 |
| Molecular weight | 200.16643 |
| Molecular Formula | C10H9NaO3 |
Application:
1,Optical adhesives and photo curing products: such as potting of optoelectronic devices, CD manufacturing, low-viscosity UV-curing printing inks etc.
2,Outdoor electrical and electronic products in electrical casting and electronic encapsulation; especially for insulation encapsulation and adhesive bonding and electronic products for those which request high resistance to Cold & Thermal Shock.
3,Outdoor coating and solvent-free coating with better weather resistant than acrylic - polyurethane coating.
4,Active diluent: Good dilution effect without bubbles and exudate, high surface finish, No effect on the basic performance of curing material of epoxy resin, such as curing shrinkage, heat distortion temperature, impact strength and tensile strength.
5,Electrical and electronic products, civil construction, anti-corrosion coatings and other general application of bisphenol A epoxy resin. Widely used in casting, winding, encapsulation, coatings, adhesives and other fields.
6,Polyvinyl chloride polycarbonate stabilizer, oil (Lubricating oil, cylinder oil, transformer oil) additives, etc.
Packing and Shipping:
BMK Glycidic Acid (sodium salt) CAS 5449-12-7 | |
| Product name | BMK Glycidic Acid |
| Synonyms | BMK Glycidic Acid(sodiumsalt);sodium,2-methyl-3-phenyloxirane-2-carboxylicacid;2-methyl-3-phenyloxirane-2-carboxylicacid;sodium2-methyl-3-phenyloxirane-2-cChemicalbookarboxylate;BMKGlycidicAcid(sodiumsalt)l)-9-methoxy-3-oxo-3H-benzo[f]chromene-2-carboxylate;GlycidicAcidsodiumsalt;BMKGlycidicAcidpowder;BMKPowderandBMKOil |
| CAS No. | 5449-12-7 |
| Molecular weight | 200.16643 |
| Molecular Formula | C10H9NaO3 |
Application:
1,Optical adhesives and photo curing products: such as potting of optoelectronic devices, CD manufacturing, low-viscosity UV-curing printing inks etc.
2,Outdoor electrical and electronic products in electrical casting and electronic encapsulation; especially for insulation encapsulation and adhesive bonding and electronic products for those which request high resistance to Cold & Thermal Shock.
3,Outdoor coating and solvent-free coating with better weather resistant than acrylic - polyurethane coating.
4,Active diluent: Good dilution effect without bubbles and exudate, high surface finish, No effect on the basic performance of curing material of epoxy resin, such as curing shrinkage, heat distortion temperature, impact strength and tensile strength.
5,Electrical and electronic products, civil construction, anti-corrosion coatings and other general application of bisphenol A epoxy resin. Widely used in casting, winding, encapsulation, coatings, adhesives and other fields.
6,Polyvinyl chloride polycarbonate stabilizer, oil (Lubricating oil, cylinder oil, transformer oil) additives, etc.
Packing and Shipping:
